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技术数据
基板类型(Base Material) FR-4、CEM-3、CEM-1、Teflon、铝基板
PTH孔径/板厚(PTH the size of hole / Board thickness) 1.0/5.0
基板厚度 (Base Board thickness) 0.4-5.0mm
铜箔厚度(Copper Thickness) 0.5-6oz
最小线粗/线隙(Minimum line width/line distance) 0.12 mm /0.12mm
最小成品孔径(Minimum finished goods pord size) 0.25mm
金属化孔(Plated through hole) 喷锡板孔内铜厚
( HASL board the copper thickness of hole)
18-25um
金属化孔(Plated through hole) 镍金板孔内铜厚
(NI/AU board the copper thickness of hole)
10-15um
金手指镀金厚度 (The AU thickness of plating gold) 0.02-0.5um
阻焊(Solder mask) 感光阻焊/热固阻焊 (LPI/Thermoset)
字符(Silkscreen ) 双面印刷、热固(Double print,Thermoset)
表面涂履 (Surface finish) OSP、热风整平(HASL)
表面涂履 (Surface finish) 镀镍/金,丝印碳油,银油
(Plating NI/AU,Carbon、argent)
成型 (Outline ) 冲、铣、V-CUT(Punch,mill,V-CUT)
最大加工面积 (Max produce area) 650mm*500mm
最终孔径公差 (Min.finished hole size and tolerance) ±0.10mm
线宽/线距公差(line width/line distance tolerance) ±20%
钻孔公差 (Drill tolerance) ±0.05mm
铣边公差 (Mill tolerance) ±0.15mm
钻槽公差 (Drill slot tolerance) ±0.10mm
锣槽公差 (Mill slot tolerance) ±0.15mm
外形公差 (Outline tolerance) ±0.15mm
V-CUT公差 (V-CUT tolerance) ±0.15mm
板翘曲度 Board wrap ≤0.7%
通断测试 (O/S Test) 测试电压(Test voltage) 0-300V
通断测试 (O/S Test ) 测试点数(Number of test) 6000
扬州永力电子有限公司 版权所有 地址:扬州市江都区宜陵镇北振兴路7号
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